Please use this identifier to cite or link to this item: https://doi.org/10.1109/TCPMT.2013.2266406
Title: Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading
Authors: Ho, S.L.
Joshi, S.P. 
Tay, A.A.O. 
Keywords: Coefficient of thermal expansion mismatch
Cohesive zone model (CZM)
Delamination
Delamination initiation
Delamination propagation
Electronics packaging
Encapsulant
Failure analysis
Failure pattern
Finite element methods (FEMs)
Fracture mechanics
Interface fracture
Interfacial fracture energy
Quad flat no leads (QFN) package
Reliability
Stress concentration thermal stress
Thermomechanical stress
Issue Date: 2013
Citation: Ho, S.L., Joshi, S.P., Tay, A.A.O. (2013). Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading. IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (11) : 1859-1867. ScholarBank@NUS Repository. https://doi.org/10.1109/TCPMT.2013.2266406
Abstract: Interfacial delamination in encapsulated silicon devices has been a great reliability concern in IC packaging. Experimental testing of a transparent quad flat no leads package is carried out with the goal of studying the delamination characteristics and investigating the viability of cohesive zone modeling in simulating delamination patterns and trends. The pattern of initiation and propagation of delamination under thermal loading is the focus of this paper. A microscope is focused on the interface between the pad and the encapsulant to capture the progressive delamination in a package that was molded without a die. When the temperature reaches a critical value, delaminations are observed to initiate and propagate in a certain pattern. The experimental setup is then modeled within the finite element framework, with the failure of the interface described through a cohesive-zone surface interaction approach. With a slight modification to the experimental procedure and through a separate finite element model, the fracture energy of the interface is estimated. It is found that the 3-D numerical model is able to capture the experimentally observed delamination pattern satisfactorily. © 2011-2012 IEEE.
Source Title: IEEE Transactions on Components, Packaging and Manufacturing Technology
URI: http://scholarbank.nus.edu.sg/handle/10635/60262
ISSN: 21563950
DOI: 10.1109/TCPMT.2013.2266406
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