Please use this identifier to cite or link to this item: https://doi.org/10.1243/09544054JEM1249
Title: Effect of crystalline orientation of a diamond tool on the machined surface in ductile mode cutting of silicon
Authors: Li, X.P. 
Cai, M.B.
Neo, W.C.L.
Sean, K.H.W.
Keywords: Crystalline behaviour
Diamond cut
Nanoscale ductile cutting
Silicon
Issue Date: 2008
Source: Li, X.P., Cai, M.B., Neo, W.C.L., Sean, K.H.W. (2008). Effect of crystalline orientation of a diamond tool on the machined surface in ductile mode cutting of silicon. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 222 (12) : 1597-1603. ScholarBank@NUS Repository. https://doi.org/10.1243/09544054JEM1249
Abstract: In nanoscale ductile mode cutting of monocrystalline silicon with single-crystal diamond tools, it was observed that under certain crystalline orientations of the diamond tool, such as with {110} or {100} for the tool rake face, good integrity of the machined surface could be generated. However, when the tool had the {111} orientation for the rake face, the machined surface was fractured. In the present study, the crystalline behaviour of the monocrystalline diamond tool in nanoscale cutting of monocrystalline silicon and its effect on the machined surface were experimentally investigated using the {100}, {110}, and {111} orientations for the rake faces of single-crystal diamond tools. The results showed that when the rake face orientation of the diamond cutter was changed from {100} or {110} to {111}, the chip formation mode changed from ductile to brittle. The cause of such behaviour of single-crystal diamond tools was found to be the different values of the Young's modulus of single-crystal diamond in the {100}, {110}, and {111} orientations. © IMechE 2008.
Source Title: Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
URI: http://scholarbank.nus.edu.sg/handle/10635/60037
ISSN: 09544054
DOI: 10.1243/09544054JEM1249
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