Please use this identifier to cite or link to this item: https://doi.org/10.1109/TADVP.2008.923390
Title: Development of stretch solder interconnections for wafer level packaging
Authors: Rajoo, R.
Lim, S.S.
Wong, E.H.
Hnin, W.Y.
Seah, S.K.W.
Tay, A.A.O. 
Iyer, M.
Tummala, R.R.
Keywords: Hourglass interconnect
Solder joint reliability
Stretch solder interconnect
Temperature cycling
Wafer level packaging
Issue Date: May-2008
Source: Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R. (2008-05). Development of stretch solder interconnections for wafer level packaging. IEEE Transactions on Advanced Packaging 31 (2) : 377-385. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2008.923390
Abstract: A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps. © 2008 IEEE.
Source Title: IEEE Transactions on Advanced Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/59946
ISSN: 15213323
DOI: 10.1109/TADVP.2008.923390
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

2
checked on Dec 6, 2017

WEB OF SCIENCETM
Citations

3
checked on Nov 22, 2017

Page view(s)

28
checked on Dec 10, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.