Please use this identifier to cite or link to this item: https://doi.org/10.1109/TEPM.2002.804613
Title: Comprehensive treatment of moisture induced failure - Recent advances
Authors: Wong, E.H.
Koh, S.W.
Lee, K.H. 
Rajoo, R.
Keywords: Delamination
Finite element
Fracture
Hygroscopic swelling
Moisture
Moisture absorption
Moisture diffusion
Plastic collapse
Popcorn cracking
Vapor pressure
Issue Date: Jul-2002
Source: Wong, E.H., Koh, S.W., Lee, K.H., Rajoo, R. (2002-07). Comprehensive treatment of moisture induced failure - Recent advances. IEEE Transactions on Electronics Packaging Manufacturing 25 (3) : 223-230. ScholarBank@NUS Repository. https://doi.org/10.1109/TEPM.2002.804613
Abstract: This paper describes a comprehensive treatment of moisture induced failure in integrated circuit (IC) packaging with emphasis on recent advances. This includes advanced technique for modeling moisture diffusion under dynamic boundary conditions such as experienced by packages during solder reflow, autoclave, and temperature-humidity cycling; advanced characterization technique for moisture sorption and diffusion properties of packaging materials including effect of edge diffusion on transverse diffusivity, anisotropic diffusivity in organic laminates, impact of non-Fickian sorption; advanced techniques for modeling vapor pressure during solder reflow; advanced techniques for modeling dynamic delamination propagation during solder reflow; interfacial fracture strength as a function of temperature and moisture; as well as plastic analysis of popcorn cracking.
Source Title: IEEE Transactions on Electronics Packaging Manufacturing
URI: http://scholarbank.nus.edu.sg/handle/10635/59750
ISSN: 1521334X
DOI: 10.1109/TEPM.2002.804613
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