Please use this identifier to cite or link to this item:
|Title:||Comprehensive treatment of moisture induced failure - Recent advances|
|Source:||Wong, E.H., Koh, S.W., Lee, K.H., Rajoo, R. (2002-07). Comprehensive treatment of moisture induced failure - Recent advances. IEEE Transactions on Electronics Packaging Manufacturing 25 (3) : 223-230. ScholarBank@NUS Repository. https://doi.org/10.1109/TEPM.2002.804613|
|Abstract:||This paper describes a comprehensive treatment of moisture induced failure in integrated circuit (IC) packaging with emphasis on recent advances. This includes advanced technique for modeling moisture diffusion under dynamic boundary conditions such as experienced by packages during solder reflow, autoclave, and temperature-humidity cycling; advanced characterization technique for moisture sorption and diffusion properties of packaging materials including effect of edge diffusion on transverse diffusivity, anisotropic diffusivity in organic laminates, impact of non-Fickian sorption; advanced techniques for modeling vapor pressure during solder reflow; advanced techniques for modeling dynamic delamination propagation during solder reflow; interfacial fracture strength as a function of temperature and moisture; as well as plastic analysis of popcorn cracking.|
|Source Title:||IEEE Transactions on Electronics Packaging Manufacturing|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Dec 14, 2017
WEB OF SCIENCETM
checked on Nov 18, 2017
checked on Dec 10, 2017
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.