Please use this identifier to cite or link to this item:
|Title:||Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear|
|Keywords:||Dynamic hard particles|
|Source:||Cai, M.B., Li, X.P., Rahman, M. (2007-09-10). Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear. Wear 263 (7-12 SPEC. ISS.) : 1459-1466. ScholarBank@NUS Repository. https://doi.org/10.1016/j.wear.2006.11.030|
|Abstract:||In nanoscale ductile mode cutting of the monocrystalline silicon wafer, micro/nano groove wear on the diamond cutting tool flank face is often observed, which is beyond the understanding based on conventional cutting processes because the silicon workpiece material is monocrystalline with the hardness lower than that of the diamond cutting tool at room temperature. From the investigation of such a phenomenon, a concept of "dynamic hard particles" generated in the chip formation zone as a result of silicon phase transformation from monocrystalline to amorphous was proposed. It was believed that the "dynamic hard particles" caused the groove wear at the tool flank. In this study, the characteristics of such "dynamic hard particles" and their relationship with the diamond tool groove wear have been investigated through molecular dynamics (MD) simulation of nanoscale ductile mode cutting of monocrystalline silicon with diamond tools. The results show that during the cutting process, due to the workpiece material phase transformation from monocrystalline to amorphous, which results in the existence of silicon atom groups with shorter bond lengths in the chip formation zone, "dynamic hard particles" having a dynamic and uneven distribution over the entire chip formation zone are formed. The distribution changes over time and cutting stages. When the cutting runs into a steady state, the "dynamic hard particles" are mostly distributed in the lower portion of chip formation zone, contributing directly to three body abrasions on the tool flank face, causing groove wear at tool flank. The dynamic distribution of the "dynamic hard particles" also causes the uncertainty of the groove wear locations at the tool flank. © 2007 Elsevier B.V. All rights reserved.|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Dec 6, 2017
WEB OF SCIENCETM
checked on Nov 21, 2017
checked on Dec 10, 2017
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.