Please use this identifier to cite or link to this item:
|Title:||An experimental investigation into the micro-electrodischarge machining behavior of p-type silicon|
|Citation:||Jahan, M.P., Lieh, T.W., Wong, Y.S., Rahman, M. (2011-11). An experimental investigation into the micro-electrodischarge machining behavior of p-type silicon. International Journal of Advanced Manufacturing Technology 57 (5-8) : 617-637. ScholarBank@NUS Repository. https://doi.org/10.1007/s00170-011-3302-x|
|Abstract:||The present study aims to investigate the feasibility of micro-structuring in p-type silicon, using conventional die-sinking electrodischarge machining (EDM). The EDM behavior of the silicon material is studied in terms of the effect of major operating parameters on the performance characteristics during the micro-hole machining. In addition, microelectrodes are fabricated successfully on the conventional EDM machine for machining different micro-structures in silicon. Three different types of micro-structures-micro- hole, blind slots, and through slots-are fabricated in p-type silicon successfully by using optimum parameters setting. It has been observed that p-type silicon is machinable by EDM using both the polarities. Moreover, like other electrodischarge machinable materials, the selection of optimum operating parameters is very important for improved performance, as those parameters are found to influence the EDM performance of silicon significantly. Finally, it has been concluded that p-type silicon is machinable into different forms of micro-structures by understanding its electrodischarge machining behavior and by careful selection of optimum parameters. © 2011 Springer-Verlag London Limited.|
|Source Title:||International Journal of Advanced Manufacturing Technology|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Dec 12, 2018
WEB OF SCIENCETM
checked on Dec 4, 2018
checked on Dec 8, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.