Please use this identifier to cite or link to this item: https://doi.org/10.1109/TCAPT.2006.880455
Title: Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact
Authors: Luan, J.-E.
Tee, T.Y.
Pek, E.
Lim, C.T. 
Zhong, Z.
Zhou, J.
Keywords: Ball grid array (BGA)
Bending
Drop test
Finite element modeling (FEM)
Solder joint reliability
Issue Date: Sep-2006
Source: Luan, J.-E., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z., Zhou, J. (2006-09). Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact. IEEE Transactions on Components and Packaging Technologies 29 (3) : 449-456. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2006.880455
Abstract: Board level solder joint reliability performance during drop test is a critical concern to semiconductor and electronic product manufacturers. A new JEDEC standard for board level drop test of handheld electronic products was just released to specify the drop test procedure and conditions. However, there is no detailed information stated on dynamic responses of printed circuit board (PCB) and solder joints which are closely related to stress and strain of solder joints that affect the solder joint reliability, nor there is any simulation technique which provides good correlation with experimental measurements of dynamic responses of PCB and the resulting solder joint reliability during the entire drop impact process. In this paper, comprehensive dynamic responses of PCB and solder joints, e.g., acceleration, strains, and resistance, are measured and analyzed with a multichannel real-time electrical monitoring system, and simulated with a novel input acceleration (Input-G) method. The solder joint failure process, i.e., crack initiation, propagation, and opening, is well understood from the behavior of dynamic resistance. It is found experimentally and numerically that the mechanical shock causes multiple PCB bending or vibration which induces the solder joint fatigue failure. It is proven that the peeling stress of the critical solder joint is the dominant failure indicator by simulation, which correlates well with the observations and assumptions by experiment. Coincidence of cyclic change among dynamic resistance of solder joints, dynamic strains of PCB, and the peeling stress of the critical solder joints indicates that the solder joint crack opens and closes when the PCB bends down and up, and the critical solder joint failure is induced by cyclic peeling stress. The failure mode and location of critical solder balls predicted by modeling correlate well with experimental observation by cross section and dye penetration tests. © 2006 IEEE.
Source Title: IEEE Transactions on Components and Packaging Technologies
URI: http://scholarbank.nus.edu.sg/handle/10635/59388
ISSN: 15213331
DOI: 10.1109/TCAPT.2006.880455
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