Please use this identifier to cite or link to this item: https://doi.org/1/128
Title: Adhesive bonding with SU-8 at wafer level for microfluidic devices
Authors: Yu, L. 
Tay, F.E.H. 
Xu, G.
Chen, B.
Avram, M.
Iliescu, C.
Keywords: Adhesive bonding
Contact imprinting
SU-8 photoresist
Wafer-to-wafer bonding
Issue Date: 1-Apr-2006
Source: Yu, L.,Tay, F.E.H.,Xu, G.,Chen, B.,Avram, M.,Iliescu, C. (2006-04-01). Adhesive bonding with SU-8 at wafer level for microfluidic devices. Journal of Physics: Conference Series 34 (1) : 776-781. ScholarBank@NUS Repository. https://doi.org/1/128
Abstract: The present work proposes an adhesive bonding technique, at wafer level, using SU-8 negative photoresist as intermediate layer. The adhesive was selective imprint on one of the bonding surface. The main applications are in microfluidic area where a low temperature bonding is required. The method consists of three major steps. First the adhesive layer is deposited on one of the bonding surface by contact imprinting from a dummy wafer where the SU-8 photoresist was initially spun, or from a Teflon cylinder. Second, the wafers to be bonded are placed in contact and aligned. In the last step, the bonding process is performed at temperatures between 100°C and 200°C, a pressure of 1000 N in vacuum on a classical wafer bonding system. The results indicate a low stress value induced by the bonding technique. In the same time the process presents a high yield: 95-100%. The technique was successfully tested in the fabrication process of a dielectrophoretic device. © 2006 IOP Publishing Ltd.
Source Title: Journal of Physics: Conference Series
URI: http://scholarbank.nus.edu.sg/handle/10635/59377
ISSN: 17426588
DOI: 1/128
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