Please use this identifier to cite or link to this item: https://doi.org/9/012
Title: A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist
Authors: Rao, V.S.
Kripesh, V.
Yoon, S.W.
Tay, A.A.O. 
Issue Date: 1-Sep-2006
Source: Rao, V.S.,Kripesh, V.,Yoon, S.W.,Tay, A.A.O. (2006-09-01). A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist. Journal of Micromechanics and Microengineering 16 (9) : 1841-1846. ScholarBank@NUS Repository. https://doi.org/9/012
Abstract: The development of thick photoresist molds using JSR THB-151N negative tone UV photoresist for the electroplating of interconnects in advanced packaging technologies has been demonstrated. Two different thick photoresist molds 65 and 130 νm high with aspect ratios of up to 2.6 have been fabricated with good reproducibility using single and double coating processes. Optimized lithography parameters using a UV aligner to achieve straight and near-vertical side-wall profiles are also reported. Near-vertical side walls similar to that obtained using SU-8 photoresist have been obtained. JSR photoresist has been found to be easily striped with no residues in solvent stripper solutions, making it suitable for wafer bumping applications and the processing of MEMS devices. Through-mold electroplating of copper and solder is also demonstrated. The simultaneous fabrication of 1167 000 high density interconnects on 8 inch wafers, using lithography and electroplating technologies, is also reported. © 2006 IOP Publishing Ltd.
Source Title: Journal of Micromechanics and Microengineering
URI: http://scholarbank.nus.edu.sg/handle/10635/59312
ISSN: 09601317
DOI: 9/012
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

75
checked on Dec 7, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.