Please use this identifier to cite or link to this item: https://doi.org/10.1109/TDMR.2003.820793
Title: A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow
Authors: Tay, A.A.O. 
Goh, K.Y.
Issue Date: Dec-2003
Source: Tay, A.A.O., Goh, K.Y. (2003-12). A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow. IEEE Transactions on Device and Materials Reliability 3 (4) : 144-151. ScholarBank@NUS Repository. https://doi.org/10.1109/TDMR.2003.820793
Abstract: This paper describes a comprehensive numerical study of the effects of many parameters on the propagation of delaminations in the die-attach layer using a finite element linear elastic fracture mechanics approach. An 80-pin plastic quad flat package of dimensions 20 mm × 14 mm × 2.7 mm was considered. The parameters investigated include the coefficient of thermal expansion (CTE) of the die-attach material, the thickness of the die-attach layer, the CTE of the pad material, and the size of the initial delamination (defect). The effect of the location of the initial delamination was studied by considering delaminations at the center, edge, and quarter-point locations along the pad/die-attach interface. The effect of swelling of the encapsulant due to moisture absorption during preconditioning at 85°C/85%RH was also considered. The combined effect of the hygrostress and thermal stress developed during solder reflow was obtained by suitably superimposing the respective stress intensity factors. The effect of the pressure of water vapor at the delamination was also investigated and found to be negligible for small delaminations. This study has shown that the propagation of delamination from an initial defect located at the edge of the pad/die-attach interface is unstable. Once delamination propagates, it will continue until the entire interface is completely delaminated.
Source Title: IEEE Transactions on Device and Materials Reliability
URI: http://scholarbank.nus.edu.sg/handle/10635/59279
ISSN: 15304388
DOI: 10.1109/TDMR.2003.820793
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

19
checked on Dec 7, 2017

WEB OF SCIENCETM
Citations

12
checked on Nov 22, 2017

Page view(s)

22
checked on Dec 17, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.