Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow

Abstract

This paper describes a comprehensive numerical study of the effects of many parameters on the propagation of delaminations in the die-attach layer using a finite element linear elastic fracture mechanics approach. The parameters investigated include the coefficient of thermal expansion (CTE) of the die-attach material, the thickness of the die-attach layer, the CTE of the pad material and the location and size of the initial delaminations (defects). The effect of the pressure of water vapor at the delamination was also investigated.