Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/58742
Title: Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow
Authors: Tay, A.A.O. 
Goh, K.Y.
Issue Date: 1999
Source: Tay, A.A.O.,Goh, K.Y. (1999). Study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow. Proceedings - Electronic Components and Technology Conference : 694-701. ScholarBank@NUS Repository.
Abstract: This paper describes a comprehensive numerical study of the effects of many parameters on the propagation of delaminations in the die-attach layer using a finite element linear elastic fracture mechanics approach. The parameters investigated include the coefficient of thermal expansion (CTE) of the die-attach material, the thickness of the die-attach layer, the CTE of the pad material and the location and size of the initial delaminations (defects). The effect of the pressure of water vapor at the delamination was also investigated.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/58742
ISSN: 05695503
Appears in Collections:Staff Publications

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