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Title: Moisture diffusion and heat transfer in plastic IC packages
Authors: Tay, A.A.O. 
Lin, T.
Keywords: Finite-element simulation
Heat transfer
Plastic IC packages
Issue Date: Jun-1996
Citation: Tay, A.A.O., Lin, T. (1996-06). Moisture diffusion and heat transfer in plastic IC packages. IEEE Transactions on Components Packaging and Manufacturing Technology Part A 19 (2) : 186-193. ScholarBank@NUS Repository.
Abstract: This paper deals with finite-element (FE) simulations of moisture diffusion during preconditioning of plastic integrated circuit (IC) packages as well as the simultaneous diffusion of heat and moisture during vapor phase reflow (VPR) soldering. More realistic 2-D analyses are described. The results show good agreement with experimental data. The limitations of hitherto one-dimensional (1-D) analyses are also examined. The transient build-up of water vapor pressure in the delaminated pad-resin interface during vapor phase reflow soldering is also obtained. It is found that, irrespective of the manner of moisture preconditioning (moisture absorption or desorption), the same critical water vapor pressure level of about 1 MPa is obtained for the plastic IC package under study. It is also shown that the water vapor in the delaminated interface never reached saturation during the short period when solder is reflowed and re-solidified. © 1996 IEEE.
Source Title: IEEE Transactions on Components Packaging and Manufacturing Technology Part A
ISSN: 10709886
DOI: 10.1109/95.506103
Appears in Collections:Staff Publications

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