Please use this identifier to cite or link to this item:
|Title:||Moisture diffusion and heat transfer in plastic IC packages|
|Authors:||Tay, A.A.O. |
Plastic IC packages
|Citation:||Tay, A.A.O., Lin, T. (1996-06). Moisture diffusion and heat transfer in plastic IC packages. IEEE Transactions on Components Packaging and Manufacturing Technology Part A 19 (2) : 186-193. ScholarBank@NUS Repository. https://doi.org/10.1109/95.506103|
|Abstract:||This paper deals with finite-element (FE) simulations of moisture diffusion during preconditioning of plastic integrated circuit (IC) packages as well as the simultaneous diffusion of heat and moisture during vapor phase reflow (VPR) soldering. More realistic 2-D analyses are described. The results show good agreement with experimental data. The limitations of hitherto one-dimensional (1-D) analyses are also examined. The transient build-up of water vapor pressure in the delaminated pad-resin interface during vapor phase reflow soldering is also obtained. It is found that, irrespective of the manner of moisture preconditioning (moisture absorption or desorption), the same critical water vapor pressure level of about 1 MPa is obtained for the plastic IC package under study. It is also shown that the water vapor in the delaminated interface never reached saturation during the short period when solder is reflowed and re-solidified. © 1996 IEEE.|
|Source Title:||IEEE Transactions on Components Packaging and Manufacturing Technology Part A|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Feb 13, 2019
WEB OF SCIENCETM
checked on Feb 4, 2019
checked on Nov 10, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.