Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/58371
Title: Impact of moisture diffusion during solder reflow on package reliability
Authors: Tay, A.A.O. 
Lin, T.Y.
Issue Date: 1999
Source: Tay, A.A.O.,Lin, T.Y. (1999). Impact of moisture diffusion during solder reflow on package reliability. Proceedings - Electronic Components and Technology Conference : 830-836. ScholarBank@NUS Repository.
Abstract: During the solder reflow process moisture will diffuse out of plastic IC packages especially at the higher temperatures. This will tend to reduce the hygrostress and hence lower the tendency to popcorn cracking. However, the extent of this reduction is still unclear. The main objective of this paper is to determine the impact of this moisture diffusion during solder reflow on package reliability. In this paper the entire thermal and moisture history of a plastic IC package is simulated from the start of level 1 moisture preconditioning (85°C/85%RH for 168 hours) to subsequent exposure to a solder reflow process lasting about 5 minutes. The transient development of the strain energy release rate due to thermal stress only, hygrostress only and combined hygrothermal stresses are computed and studied Two numerical methods of computing stress intensity factors will be used and compared as to their merits.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/58371
ISSN: 05695503
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

19
checked on Dec 8, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.