Please use this identifier to cite or link to this item:
|Title:||The power of functional scaling: Beyond the power consumption challenge and the scaling roadmap|
|Authors:||Chin, A. |
|Source:||Chin, A.,McAlister, S.P. (2005-01). The power of functional scaling: Beyond the power consumption challenge and the scaling roadmap. IEEE Circuits and Devices Magazine 21 (1) : 27-35. ScholarBank@NUS Repository. https://doi.org/10.1109/MCD.2005.1388766|
|Abstract:||The increases in the densities of devices and their functionality in circuits are making the issue of power dissipation, both static and dynamic, a serious constraint to future scaling advances. 3-D integration of novel Ge-based devices with standard Si devices is shown to provide potential ways to address the dc and ac power consumption issues in advanced ICs. Advantages of this scheme include low processing temperature and excellent lattice-match with GaAs.|
|Source Title:||IEEE Circuits and Devices Magazine|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Dec 5, 2017
WEB OF SCIENCETM
checked on Nov 4, 2017
checked on Dec 9, 2017
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.