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|Title:||Temperature control and in situ fault detection of wafer warpage|
|Authors:||Ho, W.K. |
|Citation:||Ho, W.K., Yap, C., Tay, A., Chen, W., Zhou, Y., Tan, W.W., Chen, M. (2007-02). Temperature control and in situ fault detection of wafer warpage. IEEE Transactions on Semiconductor Manufacturing 20 (1) : 1-4. ScholarBank@NUS Repository. https://doi.org/10.1109/TSM.2006.890314|
|Abstract:||Warped wafers can affect device performance, reliability, and linewidth control in various processing steps. We propose in this paper an in situ fault detection technique for wafer warpage in lithography. The use of advanced process control results in very small temperature disturbance making it suitable for industrial implementation. © 2007 IEEE.|
|Source Title:||IEEE Transactions on Semiconductor Manufacturing|
|Appears in Collections:||Staff Publications|
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