Please use this identifier to cite or link to this item:
|Title:||Plastic ball grid array reflow using a fast-modulated CW laser|
Plastic ball grid array
Sn-Pb eutectic solder ball
|Source:||Liu, D.,Lu, Y.-F.,Yuan, Y.,Chen, T.,Prematilleke, L. (2001-01). Plastic ball grid array reflow using a fast-modulated CW laser. Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers 40 (1) : 177-182. ScholarBank@NUS Repository.|
|Abstract:||Plastic ball grid array reflow using a fast-modulated CW laser is studied. A CW/Q-switched Nd:YAG laser is modified to work in the fast-modulated CW mode. Sn-Pb eutectic solder balls with a diameter of 760 μm and Au-Ni-Cu solder pads are used in the study. By varying the laser power and the laser-on time, respectively, the solderable parameter region of laser reflow for the solder balls and the solder pads is obtained. Shear strength tests are also performed to find out the optimal reflow parameters. The measured shear strength is higher than 1500 gf, with the maximum value over 1900 gf. An energy equilibrium model is proposed to compare the solderable region predicted theoretically with the experimental results and to estimate the average temperatures of solder joint under the given experimental conditions.|
|Source Title:||Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jan 14, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.