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|Title:||Novel extended-Pi shaped silicon - germanium source/drain stressors for strain and performance enhancement in p-channel tri-gate fin-type field-effect transistor|
|Citation:||Tan, K.-M., Liow, T.-Y., Lee, R.T.P., Zhu, M., Hoe, K.-M., Tung, C.-H., Balasubramanian, N., Samudra, G.S., Yeo, Y.-C. (2008-04-25). Novel extended-Pi shaped silicon - germanium source/drain stressors for strain and performance enhancement in p-channel tri-gate fin-type field-effect transistor. Japanese Journal of Applied Physics 47 (4 PART 2) : 2589-2592. ScholarBank@NUS Repository. https://doi.org/10.1143/JJAP.47.2589|
|Abstract:||Strained p-channel tri-gate fin-type field-effect transistor (FinFET) with extended-Pi (e∏) shaped SiGe source/drain (S/D) is demonstrated with enhanced drive current performance of 33% at a fixed drain induced barrier lowering (DIBL) over FinFET with ∏-SiGe S/D. The e∏ S/D stressor structure can be easily formed by simply using a longer HF cleaning time prior to the growth of SiGe in the S/D regions. The longer HF cleaning step created a recess into the buried oxide which allows SiGe to be grown below the base of the Si fin at the S/D regions, providing additional strain to the channel. Enhancement of device performance was also found to increase with the decrease of fin width and this benefit aggressively scaled tri-gate FinFET for advance technology node. © 2008 The Japan Society of Applied Physics.|
|Source Title:||Japanese Journal of Applied Physics|
|Appears in Collections:||Staff Publications|
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