Please use this identifier to cite or link to this item: https://doi.org/10.1049/el.2011.0302
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dc.titleNegative backside thermoreflectance modulation of microscale metal interconnects
dc.contributor.authorTeo, J.K.J.
dc.contributor.authorChua, C.M.
dc.contributor.authorKoh, L.S.
dc.contributor.authorPhang, J.C.H.
dc.date.accessioned2014-06-17T02:58:29Z
dc.date.available2014-06-17T02:58:29Z
dc.date.issued2011-07-07
dc.identifier.citationTeo, J.K.J., Chua, C.M., Koh, L.S., Phang, J.C.H. (2011-07-07). Negative backside thermoreflectance modulation of microscale metal interconnects. Electronics Letters 47 (14) : 821-822. ScholarBank@NUS Repository. https://doi.org/10.1049/el.2011.0302
dc.identifier.issn00135194
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/56775
dc.description.abstractThe variation of backside reflectance modulation effects on metal line samples at different electrical bias and silicon backside thicknesses is investigated. Negative reflected intensity modulations are observed and are one to two orders of magnitude larger than the values from published results. It was found that the negative reflected intensity modulation with electrical bias depends on the temperature variation of the absorption coefficient while observed positive reflectance intensity modulation is due to temperature variation of the reflectance. © 2011 The Institution of Engineering and Technology.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1049/el.2011.0302
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1049/el.2011.0302
dc.description.sourcetitleElectronics Letters
dc.description.volume47
dc.description.issue14
dc.description.page821-822
dc.description.codenELLEA
dc.identifier.isiut000292880600025
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