Please use this identifier to cite or link to this item: https://doi.org/10.1049/el.2011.0302
Title: Negative backside thermoreflectance modulation of microscale metal interconnects
Authors: Teo, J.K.J.
Chua, C.M.
Koh, L.S.
Phang, J.C.H. 
Issue Date: 7-Jul-2011
Source: Teo, J.K.J., Chua, C.M., Koh, L.S., Phang, J.C.H. (2011-07-07). Negative backside thermoreflectance modulation of microscale metal interconnects. Electronics Letters 47 (14) : 821-822. ScholarBank@NUS Repository. https://doi.org/10.1049/el.2011.0302
Abstract: The variation of backside reflectance modulation effects on metal line samples at different electrical bias and silicon backside thicknesses is investigated. Negative reflected intensity modulations are observed and are one to two orders of magnitude larger than the values from published results. It was found that the negative reflected intensity modulation with electrical bias depends on the temperature variation of the absorption coefficient while observed positive reflectance intensity modulation is due to temperature variation of the reflectance. © 2011 The Institution of Engineering and Technology.
Source Title: Electronics Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/56775
ISSN: 00135194
DOI: 10.1049/el.2011.0302
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