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|Title:||Minimum time control of conductive heating systems for microelectronics processing|
|Authors:||Tay, A. |
|Citation:||Tay, A., Ho, W.K., Poh, Y.P. (2001-11). Minimum time control of conductive heating systems for microelectronics processing. IEEE Transactions on Semiconductor Manufacturing 14 (4) : 381-386. ScholarBank@NUS Repository. https://doi.org/10.1109/66.964325|
|Abstract:||A minimum time control scheme is designed to improve repeatability by minimizing the loading effects induced by the common processing condition of placement of a semiconductor wafer at ambient temperature on a large thermal-mass bake plate at processing temperature. The minimum time control strategy provides an optimal solution for minimizing the worst case deviation from a nominal temperature set-point during the load disturbance condition. This results in a predictive controller that performs a predetermined heating sequence prior to the arrival of the wafer as part of the resulting feedforward/feedback strategy to eliminate the load disturbance. The controller is easy to design and implement and makes it more suitable for online implementation such as automatic online tuning of a feedforward controller. Experimental results depict an order-of-magnitude improvement in the settling time and the integral-square temperature error between the optimal predictive controller and a feedback controller for a typical load disturbance.|
|Source Title:||IEEE Transactions on Semiconductor Manufacturing|
|Appears in Collections:||Staff Publications|
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