Please use this identifier to cite or link to this item:
https://doi.org/10.1109/LMWC.2003.819383
DC Field | Value | |
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dc.title | Large Q-Factor Improvement for Spiral Inductors on Silicon Using Proton Implantation | |
dc.contributor.author | Chan, K.T. | |
dc.contributor.author | Huang, C.H. | |
dc.contributor.author | Chin, A. | |
dc.contributor.author | Li, M.F. | |
dc.contributor.author | Kwong, D.-L. | |
dc.contributor.author | McAlister, S.P. | |
dc.contributor.author | Duh, D.S. | |
dc.contributor.author | Lin, W.J. | |
dc.date.accessioned | 2014-06-17T02:54:46Z | |
dc.date.available | 2014-06-17T02:54:46Z | |
dc.date.issued | 2003-11 | |
dc.identifier.citation | Chan, K.T., Huang, C.H., Chin, A., Li, M.F., Kwong, D.-L., McAlister, S.P., Duh, D.S., Lin, W.J. (2003-11). Large Q-Factor Improvement for Spiral Inductors on Silicon Using Proton Implantation. IEEE Microwave and Wireless Components Letters 13 (11) : 460-462. ScholarBank@NUS Repository. https://doi.org/10.1109/LMWC.2003.819383 | |
dc.identifier.issn | 15311309 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/56454 | |
dc.description.abstract | We have improved the Q-factor of a 4.6 nH spiral inductor, fabricated on a standard Si substrate, by more than 60%, by using an optimized proton implantation process. The inductor was fabricated in a 1-poly-6-metal process, and Implanted after processing. The implantation increased the substrate impedance by ∼ one order of magnitude without disturbing the inductor value before resonance. The S-parameters were well described by an equivalent circuit model. The significantly improved inductor performance and VLSI-compatible process makes the proton implantation suitable for high performance RF ICs. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/LMWC.2003.819383 | |
dc.source | Scopus | |
dc.subject | Implantation | |
dc.subject | Inductor | |
dc.subject | Q-factor | |
dc.subject | RF | |
dc.type | Article | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.doi | 10.1109/LMWC.2003.819383 | |
dc.description.sourcetitle | IEEE Microwave and Wireless Components Letters | |
dc.description.volume | 13 | |
dc.description.issue | 11 | |
dc.description.page | 460-462 | |
dc.description.coden | IMWCB | |
dc.identifier.isiut | 000186401900002 | |
Appears in Collections: | Staff Publications |
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