Please use this identifier to cite or link to this item: https://doi.org/10.1109/TADVP.2008.927840
Title: Implementation of packaged integrated antenna with embedded front end for bluetooth applications
Authors: Rotaru, M.
Ying, L.Y.
Kuruveettil, H.
Rui, Y.
Popov, A.P. 
Chee-Parng, C.
Keywords: Dielectric resonator antenna (DRA)
Embedded front end
Embedded passives
Package integrated antenna
System in package (SiP)
Wireless module
Issue Date: 2008
Source: Rotaru, M., Ying, L.Y., Kuruveettil, H., Rui, Y., Popov, A.P., Chee-Parng, C. (2008). Implementation of packaged integrated antenna with embedded front end for bluetooth applications. IEEE Transactions on Advanced Packaging 31 (3) : 558-567. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2008.927840
Abstract: The design, integration and realization of system in enhanced package approach towards fully functional system level integration by using a compact Bluetooth USB dongle as the demonstrator is presented here. The integration was done on FR4 substrates, which is totally compatible with today's printed circuit board manufacturing capability. A commercially available Bluetooth integrated chip was chosen as the chipset of our demonstrator, and a package integrated antenna together with an embedded front end completes the system in package integration. The front end developed here is based on an embedded meander line combline filter and an embedded transformer balun. The filter has a 35% area reduction when compared with the classical combline filter and similar performance. The balun has the coils distributed on three layers that minimized the board area needed it and optimizes the performances. The proposed packaged integrated antenna approach is successfully demonstrated here and the new module shows excellent performance when compared with a commercial solution, surpassing the normal Bluetooth class II dongle range which is up to 10 m and increasing the module range up to 120 m without an extra power amplifier. © 2008 IEEE.
Source Title: IEEE Transactions on Advanced Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/56269
ISSN: 15213323
DOI: 10.1109/TADVP.2008.927840
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