Please use this identifier to cite or link to this item: https://doi.org/10.1109/TEMC.2009.2022543
DC FieldValue
dc.titleHybridization of the scattering matrix method and modal decomposition for analysis of signal traces in a power distribution network
dc.contributor.authorOo, Z.Z.
dc.contributor.authorLi, E.-P.
dc.contributor.authorWei, X.-C.
dc.contributor.authorLiu, E.-X.
dc.contributor.authorZhang, Y.-J.
dc.contributor.authorLi, L.-W.J.
dc.date.accessioned2014-06-17T02:52:20Z
dc.date.available2014-06-17T02:52:20Z
dc.date.issued2009
dc.identifier.citationOo, Z.Z., Li, E.-P., Wei, X.-C., Liu, E.-X., Zhang, Y.-J., Li, L.-W.J. (2009). Hybridization of the scattering matrix method and modal decomposition for analysis of signal traces in a power distribution network. IEEE Transactions on Electromagnetic Compatibility 51 (3 PART 2) : 784-791. ScholarBank@NUS Repository. https://doi.org/10.1109/TEMC.2009.2022543
dc.identifier.issn00189375
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/56241
dc.description.abstractA hybrid scattering matrix method (SMM) and a modal decomposition technique for analysis of signal traces in the power distribution network of an electronic package are presented in this paper. Applying the modal decomposition of the waves propagating inside the power-ground (P-G) planes and the signal traces, the electromagnetic fields can be decomposed into the parallel-plate mode and the transmission-line mode. The former is analyzed by using the SMM for the finite P-G planes with multiple vias. The multiconductor transmission-line theory is applied to model the micro-stripline and stripline in the package. Numerical simulations are illustrated for coupling analysis of P-G vias to the signal traces in the package and examined through experimental and numerical validations. © 2009 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/TEMC.2009.2022543
dc.sourceScopus
dc.subjectElectronic package
dc.subjectModal decomposition method
dc.subjectPower distribution network (PDN)
dc.subjectPower integrity
dc.subjectSignal traces
dc.subjectThrough-hole vias
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/TEMC.2009.2022543
dc.description.sourcetitleIEEE Transactions on Electromagnetic Compatibility
dc.description.volume51
dc.description.issue3 PART 2
dc.description.page784-791
dc.description.codenIEMCA
dc.identifier.isiut000269154400025
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