Please use this identifier to cite or link to this item:
https://doi.org/10.1109/TEMC.2009.2022543
DC Field | Value | |
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dc.title | Hybridization of the scattering matrix method and modal decomposition for analysis of signal traces in a power distribution network | |
dc.contributor.author | Oo, Z.Z. | |
dc.contributor.author | Li, E.-P. | |
dc.contributor.author | Wei, X.-C. | |
dc.contributor.author | Liu, E.-X. | |
dc.contributor.author | Zhang, Y.-J. | |
dc.contributor.author | Li, L.-W.J. | |
dc.date.accessioned | 2014-06-17T02:52:20Z | |
dc.date.available | 2014-06-17T02:52:20Z | |
dc.date.issued | 2009 | |
dc.identifier.citation | Oo, Z.Z., Li, E.-P., Wei, X.-C., Liu, E.-X., Zhang, Y.-J., Li, L.-W.J. (2009). Hybridization of the scattering matrix method and modal decomposition for analysis of signal traces in a power distribution network. IEEE Transactions on Electromagnetic Compatibility 51 (3 PART 2) : 784-791. ScholarBank@NUS Repository. https://doi.org/10.1109/TEMC.2009.2022543 | |
dc.identifier.issn | 00189375 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/56241 | |
dc.description.abstract | A hybrid scattering matrix method (SMM) and a modal decomposition technique for analysis of signal traces in the power distribution network of an electronic package are presented in this paper. Applying the modal decomposition of the waves propagating inside the power-ground (P-G) planes and the signal traces, the electromagnetic fields can be decomposed into the parallel-plate mode and the transmission-line mode. The former is analyzed by using the SMM for the finite P-G planes with multiple vias. The multiconductor transmission-line theory is applied to model the micro-stripline and stripline in the package. Numerical simulations are illustrated for coupling analysis of P-G vias to the signal traces in the package and examined through experimental and numerical validations. © 2009 IEEE. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/TEMC.2009.2022543 | |
dc.source | Scopus | |
dc.subject | Electronic package | |
dc.subject | Modal decomposition method | |
dc.subject | Power distribution network (PDN) | |
dc.subject | Power integrity | |
dc.subject | Signal traces | |
dc.subject | Through-hole vias | |
dc.type | Article | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.doi | 10.1109/TEMC.2009.2022543 | |
dc.description.sourcetitle | IEEE Transactions on Electromagnetic Compatibility | |
dc.description.volume | 51 | |
dc.description.issue | 3 PART 2 | |
dc.description.page | 784-791 | |
dc.description.coden | IEMCA | |
dc.identifier.isiut | 000269154400025 | |
Appears in Collections: | Staff Publications |
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