Please use this identifier to cite or link to this item:
|Title:||Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations|
|Citation:||Tiedemann, A.-K., Kurz, K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J. (2009-09). Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations. Microelectronics Reliability 49 (9-11) : 1165-1168. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2009.06.030|
|Abstract:||Thermo-elastic properties on aluminum interconnects are characterized by Scanning Joule Expansion Microscopy and complementary finite element analyses. Temperature distributions can be obtained by the correlation of the three-dimensional thermal expansion vectors and the device structure. Vertical and lateral displacements give access to thermally induced strains, which is important for advanced failure analyses on degradation processes. © 2009 Elsevier Ltd. All rights reserved.|
|Source Title:||Microelectronics Reliability|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Oct 11, 2018
WEB OF SCIENCETM
checked on Sep 26, 2018
checked on Oct 13, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.