Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.microrel.2009.06.030
Title: Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations
Authors: Tiedemann, A.-K.
Kurz, K.
Fakhri, M.
Heiderhoff, R.
Phang, J.C.H. 
Balk, L.J.
Issue Date: Sep-2009
Source: Tiedemann, A.-K., Kurz, K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J. (2009-09). Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations. Microelectronics Reliability 49 (9-11) : 1165-1168. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2009.06.030
Abstract: Thermo-elastic properties on aluminum interconnects are characterized by Scanning Joule Expansion Microscopy and complementary finite element analyses. Temperature distributions can be obtained by the correlation of the three-dimensional thermal expansion vectors and the device structure. Vertical and lateral displacements give access to thermally induced strains, which is important for advanced failure analyses on degradation processes. © 2009 Elsevier Ltd. All rights reserved.
Source Title: Microelectronics Reliability
URI: http://scholarbank.nus.edu.sg/handle/10635/56061
ISSN: 00262714
DOI: 10.1016/j.microrel.2009.06.030
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