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|Title:||Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations|
|Citation:||Tiedemann, A.-K., Kurz, K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J. (2009-09). Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations. Microelectronics Reliability 49 (9-11) : 1165-1168. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2009.06.030|
|Abstract:||Thermo-elastic properties on aluminum interconnects are characterized by Scanning Joule Expansion Microscopy and complementary finite element analyses. Temperature distributions can be obtained by the correlation of the three-dimensional thermal expansion vectors and the device structure. Vertical and lateral displacements give access to thermally induced strains, which is important for advanced failure analyses on degradation processes. © 2009 Elsevier Ltd. All rights reserved.|
|Source Title:||Microelectronics Reliability|
|Appears in Collections:||Staff Publications|
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