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Title: Fabrication of sub-50 nm current-perpendicular-to-plane spin valve sensors
Authors: Han, G.C.
Li, K.B.
Zheng, Y.K.
Qiu, J.J.
Luo, P.
An, L.H.
Guo, Z.B.
Liu, Z.Y.
Wu, Y.H. 
Keywords: CPP spin valve
Feature size
Issue Date: 18-May-2006
Citation: Han, G.C., Li, K.B., Zheng, Y.K., Qiu, J.J., Luo, P., An, L.H., Guo, Z.B., Liu, Z.Y., Wu, Y.H. (2006-05-18). Fabrication of sub-50 nm current-perpendicular-to-plane spin valve sensors. Thin Solid Films 505 (1-2) : 41-44. ScholarBank@NUS Repository.
Abstract: A new process is developed to fabricate sub-50 nm current-perpendicular-to- plane (CPP) spin valve sensors. This processing technology relates to a feature reduction method using hard mask technique. The feature size is first reduced by an isotropic wet etch process of hard mask, and then transferred to CPP sensor by an ion milling process. Using this approach, the feature size can be reduced from above 100 nm determined by lithography technology to several nanometers. An etch back process is developed for the sensor via opening. Sidewall-free sub-50 nm CPP sensors have been successfully fabricated. The sensors are characterized through magnetoresistance measurements and show typical CPP characteristics. © 2005 Elsevier B.V. All rights reserved.
Source Title: Thin Solid Films
ISSN: 00406090
DOI: 10.1016/j.tsf.2005.10.035
Appears in Collections:Staff Publications

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