Please use this identifier to cite or link to this item: https://doi.org/10.1063/1.1585119
Title: Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees
Authors: Gan, C.L.
Thompson, C.V.
Pey, K.L.
Choi, W.K. 
Issue Date: 15-Jul-2003
Source: Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K. (2003-07-15). Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees. Journal of Applied Physics 94 (2) : 1222-1228. ScholarBank@NUS Repository. https://doi.org/10.1063/1.1585119
Abstract: The modeling and characterization of the reliability of the dual-damascene copper interconnect trees was discussed. The reliability depends on the stress conditions of the connected segments. However, electromigration tests revealed different results for copper based trees and aluminium based trees. The architectural schemes of the two metallization systems were found as the reason behind this difference.
Source Title: Journal of Applied Physics
URI: http://scholarbank.nus.edu.sg/handle/10635/55955
ISSN: 00218979
DOI: 10.1063/1.1585119
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