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|Title:||Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees|
|Citation:||Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K. (2003-07-15). Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees. Journal of Applied Physics 94 (2) : 1222-1228. ScholarBank@NUS Repository. https://doi.org/10.1063/1.1585119|
|Abstract:||The modeling and characterization of the reliability of the dual-damascene copper interconnect trees was discussed. The reliability depends on the stress conditions of the connected segments. However, electromigration tests revealed different results for copper based trees and aluminium based trees. The architectural schemes of the two metallization systems were found as the reason behind this difference.|
|Source Title:||Journal of Applied Physics|
|Appears in Collections:||Staff Publications|
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