Please use this identifier to cite or link to this item: https://doi.org/10.1088/0960-1317/11/1/310
Title: Evolution of hillocks during silicon etching in TMAH
Authors: Thong, J.T.L. 
Luo, P.
Choi, W.K. 
Tan, S.C.
Issue Date: Jan-2001
Citation: Thong, J.T.L., Luo, P., Choi, W.K., Tan, S.C. (2001-01). Evolution of hillocks during silicon etching in TMAH. Journal of Micromechanics and Microengineering 11 (1) : 61-69. ScholarBank@NUS Repository. https://doi.org/10.1088/0960-1317/11/1/310
Abstract: The evolution of hillocks on (100)-silicon etched in 4 wt% tetramethyl ammonium hydroxide is studied through a detailed examination of hillock size distribution and individual hillock features using low-voltage scanning electron microscopy. Silicon samples etched for periods of 1.5, 3 and 5 min show that the population of hillocks initially comprises small, square-based pyramids with a wide distribution of aspect ratios ranging up to tall pyramids typifying {111}-bounded pyramids. As etching progresses, the population extends to larger pyramids, the majority of which are somewhat flatter than expected of {111}-bounded pyramids. Detailed examination of individual hillocks suggests that some {111}-bounded pyramids undergo a transformation that eventually leads to a quasi-stable bow-faced hillock configuration. Others collapse from the apex through erosion of the main faces. A number of dissolution routes are observed, and it is postulated that a hillock may undergo a series of fast transformations during its lifetime with intermediate configurations that are quasi-stable.
Source Title: Journal of Micromechanics and Microengineering
URI: http://scholarbank.nus.edu.sg/handle/10635/55922
ISSN: 09601317
DOI: 10.1088/0960-1317/11/1/310
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