Please use this identifier to cite or link to this item: https://doi.org/10.1109/TADVP.2008.927841
Title: Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method
Authors: Wei, X.-C.
Li, E.-P. 
Liu, E.-X.
Chua, E.-K.
Oo, Z.-Z.
Vahldieck, R.
Keywords: Dyadic Green's function
Electromagnetic compatibility
High-speed electronic package
Integral equation
Powerground planes
Simultaneous switching noise
Issue Date: 2008
Source: Wei, X.-C., Li, E.-P., Liu, E.-X., Chua, E.-K., Oo, Z.-Z., Vahldieck, R. (2008). Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method. IEEE Transactions on Advanced Packaging 31 (3) : 536-543. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2008.927841
Abstract: A novel method based on hybrid integral equation for electromagnetic emission and susceptibility modeling of power-ground planes with a finite size is proposed in this paper. First, the entire computational domain is divided into the internal subdomain including the substrate sandwiched between the power and ground planes and the external subdomain surrounding the power-ground planes. The internal subdomain is modeled by using the integral equation with dyadic Green's functions of the rectangular cavity, while the free-space Green's function is used to model the outside subdomain. These two kinds of integral equations are coupled through the equivalent electric and magnetic currents that are placed on the interfaces. The key advantage of this proposed method is its ability to model both emission and susceptibility problems. This method can accurately simulate the impedance of the power-ground planes and the radiated field. In particular, it is able to predict the induced electric currents inside the power-ground planes that result from external interference sources. Therefore, this technique is able to provide a complete solution for the electromagnetic compatibility analysis of the system-level package. © 2008 IEEE.
Source Title: IEEE Transactions on Advanced Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/55863
ISSN: 15213323
DOI: 10.1109/TADVP.2008.927841
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