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|Title:||Critical dimension and real-time temperature control for warped wafers|
|Authors:||Ho, W.K. |
|Citation:||Ho, W.K., Tay, A., Fu, J., Chen, M., Feng, Y. (2008-12). Critical dimension and real-time temperature control for warped wafers. Journal of Process Control 18 (10) : 916-921. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jprocont.2007.11.009|
|Abstract:||In this paper, we present the experimental results on critical dimension (CD) control via real-time temperature control for warped wafers. As opposed to run-to-run control where information from the previous wafer or batch is used for control of the current wafer or batch, the approach here is real-time and make use of current information for control of the current wafer CD. In this paper we demonstrate that real-time control of the post-exposure bake temperature to give nonuniform temperature distribution across the warped wafer can reduce CD nonuniformity across the wafer. © 2007 Elsevier Ltd. All rights reserved.|
|Source Title:||Journal of Process Control|
|Appears in Collections:||Staff Publications|
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