Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.jprocont.2007.11.009
Title: Critical dimension and real-time temperature control for warped wafers
Authors: Ho, W.K. 
Tay, A. 
Fu, J. 
Chen, M.
Feng, Y.
Keywords: Critical dimension
Lithography
Real-time control
Wafer warpage
Issue Date: Dec-2008
Source: Ho, W.K.,Tay, A.,Fu, J.,Chen, M.,Feng, Y. (2008-12). Critical dimension and real-time temperature control for warped wafers. Journal of Process Control 18 (10) : 916-921. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jprocont.2007.11.009
Abstract: In this paper, we present the experimental results on critical dimension (CD) control via real-time temperature control for warped wafers. As opposed to run-to-run control where information from the previous wafer or batch is used for control of the current wafer or batch, the approach here is real-time and make use of current information for control of the current wafer CD. In this paper we demonstrate that real-time control of the post-exposure bake temperature to give nonuniform temperature distribution across the warped wafer can reduce CD nonuniformity across the wafer. © 2007 Elsevier Ltd. All rights reserved.
Source Title: Journal of Process Control
URI: http://scholarbank.nus.edu.sg/handle/10635/55471
ISSN: 09591524
DOI: 10.1016/j.jprocont.2007.11.009
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

3
checked on Dec 12, 2017

Page view(s)

53
checked on Dec 7, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.