Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/55334
Title: Combining refractive solid immersion lens and pulsed laser-induced technique for integrated circuit failure analysis
Authors: Goh, S.H.
Quah, A.C.T.
Ravikumar, V.K.
Phoa, S.L.
Narang, V.
Chin, J.M.
Chua, C.M.
Phang, J.C.H. 
Issue Date: 2010
Source: Goh, S.H.,Quah, A.C.T.,Ravikumar, V.K.,Phoa, S.L.,Narang, V.,Chin, J.M.,Chua, C.M.,Phang, J.C.H. (2010). Combining refractive solid immersion lens and pulsed laser-induced technique for integrated circuit failure analysis. Electronic Device Failure Analysis 12 (3) : 20-27. ScholarBank@NUS Repository.
Abstract: The use of a refractive solid immersion lens (RSIL) and the pulsed laser-induced technique for enhancement in localization precision are presented. Case studies illustrating the combination of RSIL and the pulsed laser-induced technique for improved localization precision and sensitivity are also presented. The detection sensitivity of thermally-induced voltage alteration (TIVA) can be enhanced by using a pulsed laser with a digital lock-in detection algorithm incorporated in the scanning optical microscopy (SOM) system. TIVA image of a single metal-line structure at 100 μA biasing current shows significant signal enhancement when the digital lockin detection algorithm is implemented at a pulsing frequency of 1.28 kHz. A first case study illustrating the enhancement of localization precision with RSIL due to laser spot size reduction shows that combining RSIL and pulsed TIVA delivers significantly better localization precision and detection sensitivity.
Source Title: Electronic Device Failure Analysis
URI: http://scholarbank.nus.edu.sg/handle/10635/55334
ISSN: 15370755
Appears in Collections:Staff Publications

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