Please use this identifier to cite or link to this item: https://doi.org/10.1109/TEMC.2005.847383
Title: Analysis on the effectiveness of the 20-H rule for printed-circuit-board layout to reduce edge-radiated coupling
Authors: Montrose, M.I.
Li, E.-P. 
Jin, H.-F.
Yuan, W.-L.
Keywords: 20-H rule
Finite-difference time-domain (FDTD) simulation
Printed circuit board (PCB)
Issue Date: May-2005
Source: Montrose, M.I., Li, E.-P., Jin, H.-F., Yuan, W.-L. (2005-05). Analysis on the effectiveness of the 20-H rule for printed-circuit-board layout to reduce edge-radiated coupling. IEEE Transactions on Electromagnetic Compatibility 47 (2) : 227-233. ScholarBank@NUS Repository. https://doi.org/10.1109/TEMC.2005.847383
Abstract: This paper presents the quantified study of the electromagnetic radiation mechanism of the 20-H rule using a numerical approach that has not yet been systematically addressed. The 20-H rule is a rule-of-thumb layout technique recommended to minimize radiated fields propagating from the edges of a printed circuit board (PCB) coupling onto nearby structures. Propagating electromagnetic fields may corrupt adjacent cable assemblies, sheet metal enclosures, and aperture openings. The magnitude of this design rule is investigated using the full-wave finite-difference time-domain (FDTD) method. An analysis on whether benefits exist from use of this rule is examined and under what conditions the rule is valid when correctly implemented. The purpose of this paper is to provide insight into the validity of the 20-H rule, recognizing that every PCB will have different simulation results. FDTD is used to capture a snapshot view of field propagation. This view allows one to determine the validity of the 20-H rule at a single point of time within a dynamic structure and what may be expected when digital components are finally added to a PCB assembly, which generally negates simulated results. © 2005 IEEE.
Source Title: IEEE Transactions on Electromagnetic Compatibility
URI: http://scholarbank.nus.edu.sg/handle/10635/55101
ISSN: 00189375
DOI: 10.1109/TEMC.2005.847383
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