Please use this identifier to cite or link to this item: https://doi.org/10.1002/mop.11163
DC FieldValue
dc.titleAnalysis of signal propagation on high-speed planar interconnect systems based on full-wave and macromodeling techniques
dc.contributor.authorLiu, E.-X.
dc.contributor.authorLi, E.-P.
dc.contributor.authorLi, L.-W.
dc.date.accessioned2014-06-17T02:39:05Z
dc.date.available2014-06-17T02:39:05Z
dc.date.issued2003-11-05
dc.identifier.citationLiu, E.-X., Li, E.-P., Li, L.-W. (2003-11-05). Analysis of signal propagation on high-speed planar interconnect systems based on full-wave and macromodeling techniques. Microwave and Optical Technology Letters 39 (3) : 183-187. ScholarBank@NUS Repository. https://doi.org/10.1002/mop.11163
dc.identifier.issn08952477
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/55093
dc.description.abstractAn accurate and systematic approach for the analysis of signal propagation at high-speed planar interconnect systems is proposed in this paper. The approach integrates a macromodeling technique based on the full-wave time domain method and rational function approximation together with the SPICE circuit simulation. The admitance Y transfer function in the form of a set of discrete frequency sampling data is established by using the full-wave finite-difference time-domain (FDTD) method, which characterizes the high-speed planar interconnect subnetwork. Thereafter, the macromodel of the interconnect subnetwork is constructed through rational function approximation by using the Vector fitting method, which results in an accurate and robust solution for the overall problem. Subsequently, the resultant macromodel can be synthesised and converted to a SPICE-compatible equivalent circuit. Therefore, the signal propagation analysis is finally facilitated and expedited by using the SPICE circuit simulator. Numerical experiments are presented in this paper to verify the accuracy and efficiency of the proposed method.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1002/mop.11163
dc.sourceScopus
dc.subjectFDTD method
dc.subjectHigh-speed planar interconnects
dc.subjectMacromodeling
dc.subjectSignal propagation
dc.subjectY parameters
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1002/mop.11163
dc.description.sourcetitleMicrowave and Optical Technology Letters
dc.description.volume39
dc.description.issue3
dc.description.page183-187
dc.description.codenMOTLE
dc.identifier.isiut000185553300005
Appears in Collections:Staff Publications

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