Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.ijthermalsci.2007.07.016
Title: A parametric study of phase change material (PCM)-based heat sinks
Authors: Wang, X.-Q. 
Yap, C. 
Mujumdar, A.S. 
Keywords: Electronic cooling
Heat sink
Phase change material
Issue Date: Aug-2008
Source: Wang, X.-Q., Yap, C., Mujumdar, A.S. (2008-08). A parametric study of phase change material (PCM)-based heat sinks. International Journal of Thermal Sciences 47 (8) : 1055-1068. ScholarBank@NUS Repository. https://doi.org/10.1016/j.ijthermalsci.2007.07.016
Abstract: A numerical study is conducted to evaluate the thermal characteristics of a PCM-based heat sink which can be potentially used for cooling of mobile electronic devices such as personal digital assistants (PDAs) and notebooks. The heat sink consists of a conventional, extruded aluminum sink embedded with appropriate PCMs. Some important parameters, such as PCM volume fraction, temperature difference, aspect ratio, and PCM properties, were studied to investigate their effects on the thermal performance of the hybrid cooling system. © 2007 Elsevier Masson SAS. All rights reserved.
Source Title: International Journal of Thermal Sciences
URI: http://scholarbank.nus.edu.sg/handle/10635/54688
ISSN: 12900729
DOI: 10.1016/j.ijthermalsci.2007.07.016
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