Please use this identifier to cite or link to this item: https://doi.org/2007/64589
Title: A molecular dynamics study of the effect of voids on the deformation behavior of nanocrystalline copper
Authors: Zheng, C.
Zhang, Y.-W. 
Issue Date: 2007
Source: Zheng, C., Zhang, Y.-W. (2007). A molecular dynamics study of the effect of voids on the deformation behavior of nanocrystalline copper. Journal of Nanomaterials 2007 : -. ScholarBank@NUS Repository. https://doi.org/2007/64589
Abstract: Molecular dynamics simulations are performed to study the effect of preexisting ellipsoidal voids on the tensile deformation behavior in nanocrystalline copper. No crack propagation is observed regardless of the orientation of the voids with respect to the tensile direction. However it is found that the voids may assist the shear plane formation via (1) emitting dislocations from the void tips, (2) relieving triple-junction confinement, and (3) catalyzing grain splitting.
Source Title: Journal of Nanomaterials
URI: http://scholarbank.nus.edu.sg/handle/10635/54437
ISSN: 16874110
DOI: 2007/64589
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