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Title: A J-integral criterion for delamination of bi-material interfaces incorporating hygrothermal stress
Authors: Lin, T.Y.
Tay, A.A.O. 
Issue Date: 1997
Source: Lin, T.Y.,Tay, A.A.O. (1997). A J-integral criterion for delamination of bi-material interfaces incorporating hygrothermal stress. American Society of Mechanical Engineers, EEP 19 (2) : 1421-1428. ScholarBank@NUS Repository.
Abstract: The moisture absorbed by the encapsulant of plastic IC packages causes dimensional changes and give rise to hygrostresses which combines with thermal stresses during solder reflow to cause delamination and cracking. In this paper, a J-integral criterion is developed for predicting delamination at interfaces in plastic IC packages which accounts for the combined effects of hygro- and thermal stresses. The procedure developed can be used to analyse delamination and cracking in plastic IC packages undergoing solder reflow. A two-dimensional finite element model has been established to evaluate the effect of moisture diffusion coefficient, hygro-swelling coefficient, initial interfacial flaw sizes and thickness of molding compound on interfacial stress intensity factors of 3-point bending specimens. The finite element results were then compared with the interfacial fracture toughness measured from experiments. It has been demonstrated that the crack will propagate if the moisture content reaches a critical value.
Source Title: American Society of Mechanical Engineers, EEP
Appears in Collections:Staff Publications

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