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|Title:||A high-speed MEMS grating laser scanner with a backside thinned grating platform fabricated using a single mask delay etching technique|
|Authors:||Du, Y. |
|Source:||Du, Y.,Zhou, G.,Cheo, K.K.L.,Zhang, Q.,Feng, H.,Chau, F.S. (2010-11). A high-speed MEMS grating laser scanner with a backside thinned grating platform fabricated using a single mask delay etching technique. Journal of Micromechanics and Microengineering 20 (11) : -. ScholarBank@NUS Repository. https://doi.org/11/115028|
|Abstract:||A novel micro-electromechanical system (MEMS) technology-based grating laser scanner with a backside thinned grating platform has been successfully developed for high-speed laser scanning applications. The grating platform is thinned by a round cavity and reinforced by a circular frame, which are fabricated using a single mask delay etching (SMDE) technique. The SMDE technique, which utilizes the well-know loading effects of the deep reactive ion etching (DRIE) process, is a simple and low-cost methodology to regulate the etching rate of a prescribed area. It can be used in a silicon-on-insulator (SOI) micromachining process to form multilevel structures in a silicon device layer through a multi-step DRIE process from a wafer's backside. This paper presents the design, simulation, fabrication process and characterization of the high-speed MEMS grating scanner as well as the principle and applications of the SMDE technique. When illuminated with a 635 nm wavelength incident laser beam, the prototype scanner with a 1 mm diameter diffraction grating is capable of scanning at 50.192 kHz with an optical scan angle of 14.1°. © 2010 IOP Publishing Ltd.|
|Source Title:||Journal of Micromechanics and Microengineering|
|Appears in Collections:||Staff Publications|
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