Please use this identifier to cite or link to this item:
Title: A heater plate assisted bake/chill system for photoresist processing in photolithography
Authors: Chua, H.T.
Tay, A. 
Wang, Y.
Wu, X.
Keywords: Lithography
Mica heater
Temperature control
Issue Date: Apr-2009
Source: Chua, H.T., Tay, A., Wang, Y., Wu, X. (2009-04). A heater plate assisted bake/chill system for photoresist processing in photolithography. Applied Thermal Engineering 29 (5-6) : 985-997. ScholarBank@NUS Repository.
Abstract: A thermal processing module, which consists of a dense distribution of multivariate controlled heat/chill elements, is developed to achieve temperature uniformity of a silicon wafer throughout the processing temperature cycle of ramp, hold and quench in microlithography. In the proposed unit, the bake and chill steps are conducted sequentially within the same module without any substrate movement. The unit includes two heating sources. The first is a mica heater which serves as the dominant means for heat transfer. The second is a set of thermoelectric devices (TEDs) which are used to provide a distributed amount of heat to the substrate for uniformity and transient temperature control. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. The feasibility of a practical system is demonstrated via detailed modeling and simulations based on first principle heat transfer analysis. © 2008 Elsevier Ltd. All rights reserved.
Source Title: Applied Thermal Engineering
ISSN: 13594311
DOI: 10.1016/j.applthermaleng.2008.05.024
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.


checked on Mar 19, 2018

Page view(s)

checked on Mar 11, 2018

Google ScholarTM



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.