Please use this identifier to cite or link to this item: https://doi.org/10.1109/TEPM.2005.856539
Title: A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology
Authors: Liu, J.
Cao, L.
Xie, M. 
Goh, T.-N. 
Tang, Y.
Keywords: Anisotropic conductive adhesive
Failure criteria
Flip-chip
Reliability
Weibull model
Issue Date: Oct-2005
Source: Liu, J., Cao, L., Xie, M., Goh, T.-N., Tang, Y. (2005-10). A general Weibull model for reliability analysis under different failure criteria - Application on anisotropic conductive adhesive joining technology. IEEE Transactions on Electronics Packaging Manufacturing 28 (4) : 322-327. ScholarBank@NUS Repository. https://doi.org/10.1109/TEPM.2005.856539
Abstract: In this paper, a generic four-parameter model has been developed and applied to the anisotropic conductive adhesive (ACA) flip-chip joining technology for electronics packaging applications. The model can also be used to predict any minimum failure cycles if the maximum acceptable failure criterion (in this case, a preset electrical resistance value) is set. The original reliability testing from which the test data was obtained was carried out on flip-chip anisotropically conductive adhesive joints on an FR-4 substrate. In the study, nine types of ACA and one nonconductive film (NCF) were used. In total, nearly 1000 single joints were subjected to reliability tests in terms of temperature cycling between -40 °C and 125 °C with a dwell time of 15 min and a ramp rate of 110 °C/min. The reliability was characterized by single contact resistance measured using the four-probe method during temperature cycling testing up to 3000 cycles. A single Weibull model is used for two failure definitions defined as larger than 50 mΩ and larger than 100 mΩ respectively using the in situ electrical resistance measurement technique. The failure criteria are incorporated into this Weibull model. This paper shows the flexibility and usefulness of Weibull distribution in this type of applications. © 2005 IEEE.
Source Title: IEEE Transactions on Electronics Packaging Manufacturing
URI: http://scholarbank.nus.edu.sg/handle/10635/54199
ISSN: 1521334X
DOI: 10.1109/TEPM.2005.856539
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