Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/54121
Title: A fast algorithm for detecting die extrusion defects in IC packages
Authors: Zhou, H.
Kassim, A.A. 
Ranganath, S. 
Keywords: Die extrusion defects
Feature enhancement
IC package inspection
Linear feature extraction
Issue Date: Jun-1998
Source: Zhou, H.,Kassim, A.A.,Ranganath, S. (1998-06). A fast algorithm for detecting die extrusion defects in IC packages. Machine Vision and Applications 11 (1-2) : 37-41. ScholarBank@NUS Repository.
Abstract: In this paper, we present a fast method for the detection of die extrusion defects in IC packages. The optical and lighting set-up as well as the details of the algorithm used for the isolation and detection of die extrusion defects are presented. Our algorithm basically involves the use of optimal filters for the detection of linear features and other feature enhancement techniques. This paper also addresses implementation issues including speed, effectiveness, and robustness.
Source Title: Machine Vision and Applications
URI: http://scholarbank.nus.edu.sg/handle/10635/54121
ISSN: 09328092
Appears in Collections:Staff Publications

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