Please use this identifier to cite or link to this item:
|Title:||A fast algorithm for detecting die extrusion defects in IC packages|
|Keywords:||Die extrusion defects|
IC package inspection
Linear feature extraction
|Citation:||Zhou, H.,Kassim, A.A.,Ranganath, S. (1998-06). A fast algorithm for detecting die extrusion defects in IC packages. Machine Vision and Applications 11 (1-2) : 37-41. ScholarBank@NUS Repository.|
|Abstract:||In this paper, we present a fast method for the detection of die extrusion defects in IC packages. The optical and lighting set-up as well as the details of the algorithm used for the isolation and detection of die extrusion defects are presented. Our algorithm basically involves the use of optimal filters for the detection of linear features and other feature enhancement techniques. This paper also addresses implementation issues including speed, effectiveness, and robustness.|
|Source Title:||Machine Vision and Applications|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Nov 24, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.