Please use this identifier to cite or link to this item:
|Title:||Application of direct covalent molecular assembly in the fabrication of polyimide ultrathin films|
|Authors:||Zhang, F. |
|Source:||Zhang, F., Jia, Z., Srinivasan, M.P. (2005-04-12). Application of direct covalent molecular assembly in the fabrication of polyimide ultrathin films. Langmuir 21 (8) : 3389-3395. ScholarBank@NUS Repository. https://doi.org/10.1021/la048741r|
|Abstract:||Ultrathin films were fabricated using synthesized hydroxyl polyimide (HPI) in a layer-by-layer fashion on amine-terminated substrates of silicon, quartz, and gold. The interlayer linkages were established by using terephthaloyl chloride as a bridging agent to form ester groups between HPI layers. Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, UV-vis absorption spectroscopy, atomic force microscopy, ellipsometry, and electrochemical impedance spectroscopy were employed to study the interfacial chemistry, stepwise growth, morphology, thickness, optical property, and insulation behavior of the assembled film. The films show excellent stability and strength, which can be attributed to the covalent interlayer linkage. © 2005 American Chemical Society.|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Mar 8, 2018
WEB OF SCIENCETM
checked on Feb 13, 2018
checked on Mar 12, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.