Please use this identifier to cite or link to this item: https://doi.org/10.1115/IMECE2004-60456
Title: Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates
Authors: Nai, S.M.L.
Wong, C.K.
Wei, J.
Gupta, M. 
Issue Date: 2004
Source: Nai, S.M.L.,Wong, C.K.,Wei, J.,Gupta, M. (2004). Enhancing the performance of Sn-Ag-Cu solder with the addition of titanium diboride particulates. American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP 4 : 315-318. ScholarBank@NUS Repository. https://doi.org/10.1115/IMECE2004-60456
Abstract: In this study, varying volume percentage of titanium diboride particulates were successfully incorporated into Sn-Ag-Cu solder, to synthesize lead-free composite solders. The composite solders were synthesized via the powder metallurgy route of: blending, compaction, sintering and extrusion. The extruded materials were then characterized for their microstructural development, thermal and mechanical properties. With increasing volume percentage of titanium diboride particulates, the composite solders experienced a corresponding decrease in density values but porosity levels were observed to increase. Microstructural characterization using scanning electron microscopy revealed uniform distribution of reinforcement particulates and a fairly good interfacial integrity between the particulates and the solder matrix. Thermomechanical analysis showed that presence of titanium diboride particulates as reinforcements, decreased the average coefficient of thermal expansion of the solder composites. A change in the mechanical properties was also observed with the presence of increasing particulates. An attempt is made, to correlate the increasing presence of titanium diboride particulates with the microstructural development, as well as the mechanical and thermal properties of solder matrix. Copyright © 2004 by ASME.
Source Title: American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
URI: http://scholarbank.nus.edu.sg/handle/10635/51594
DOI: 10.1115/IMECE2004-60456
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