Please use this identifier to cite or link to this item: https://doi.org/10.1115/IMECE2008-66308
Title: Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder
Authors: Babaghorbani, P.
Gupta, M. 
Issue Date: 2009
Source: Babaghorbani, P.,Gupta, M. (2009). Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder. ASME International Mechanical Engineering Congress and Exposition, Proceedings 15 : 85-88. ScholarBank@NUS Repository. https://doi.org/10.1115/IMECE2008-66308
Abstract: The manufacturing techniques of powder metallurgy and casting were used to synthesize a Sn-3.5Ag followed by hot extrusion. In the sintering step of powder metallurgy, two routes of conventional and microwave sintering were investigated. Physical, microstructural, thermomechanical and mechanical properties of the developed solders were examined. These studies revealed that the best combination of the properties is realized from the Sn-3.5Ag synthesized using powder metallurgy incorporating microwave sintering route. An attempt is made to correlate processing-microstructure-properties relationship for Sn-3.5Ag. Copyright © 2008 by ASME.
Source Title: ASME International Mechanical Engineering Congress and Exposition, Proceedings
URI: http://scholarbank.nus.edu.sg/handle/10635/51589
ISBN: 9780791848760
DOI: 10.1115/IMECE2008-66308
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