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|Title:||Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder|
|Source:||Babaghorbani, P.,Gupta, M. (2009). Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder. ASME International Mechanical Engineering Congress and Exposition, Proceedings 15 : 85-88. ScholarBank@NUS Repository. https://doi.org/10.1115/IMECE2008-66308|
|Abstract:||The manufacturing techniques of powder metallurgy and casting were used to synthesize a Sn-3.5Ag followed by hot extrusion. In the sintering step of powder metallurgy, two routes of conventional and microwave sintering were investigated. Physical, microstructural, thermomechanical and mechanical properties of the developed solders were examined. These studies revealed that the best combination of the properties is realized from the Sn-3.5Ag synthesized using powder metallurgy incorporating microwave sintering route. An attempt is made to correlate processing-microstructure-properties relationship for Sn-3.5Ag. Copyright © 2008 by ASME.|
|Source Title:||ASME International Mechanical Engineering Congress and Exposition, Proceedings|
|Appears in Collections:||Staff Publications|
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