Please use this identifier to cite or link to this item: https://doi.org/10.1115/IMECE2005-79457
Title: Effect of of carbon nanotubes on the wettability and mechanical performance of Sn-Ag-Cu solder
Authors: Nay, S.M.L.
Wei, J.
Gupta, M. 
Issue Date: 2005
Source: Nay, S.M.L.,Wei, J.,Gupta, M. (2005). Effect of of carbon nanotubes on the wettability and mechanical performance of Sn-Ag-Cu solder. American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP 5 : 243-246. ScholarBank@NUS Repository. https://doi.org/10.1115/IMECE2005-79457
Abstract: In this study, Sn-Ag-Cu based nanocomposites with carbon nanotubes (CNTs) as reinforcements were successfully synthesized using the powder metallurgy technique. Micron size lead-free solder particles were blended together with varying weight percentages of CNTs. Blended powder mixtures were then compacted, sintered and finally extruded at room temperature. The extruded materials were characterized for their melting temperatures, wettability and mechanical properties. Experimental results revealed that the melting temperatures of the composite solders did not have any significant changes. Wettability property of the composite solder was also found to improve with addition of reinforcements. Moreover, the results of mechanical properties characterization exhibited an increase in overall strength of the composite solders. An attempt is made in the present study to correlate the variation in weight percentages of reinforcement with the properties of the resultant nanocomposite materials. These advanced interconnect materials will benefit industries like the microelectronics flip chip assembly and packaging, MEMS systems and NEMS systems. Copyright © 2005 by ASME.
Source Title: American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
URI: http://scholarbank.nus.edu.sg/handle/10635/51586
DOI: 10.1115/IMECE2005-79457
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