Please use this identifier to cite or link to this item: https://doi.org/10.1115/HT2009-88585
Title: An efficient wavy microchannel heat sink for electronic devices
Authors: Sui, Y. 
Teo, C.J. 
Lee, P.S. 
Chew, Y.T. 
Shu, C. 
Issue Date: 2009
Source: Sui, Y.,Teo, C.J.,Lee, P.S.,Chew, Y.T.,Shu, C. (2009). An efficient wavy microchannel heat sink for electronic devices. Proceedings of the ASME Summer Heat Transfer Conference 2009, HT2009 1 : 719-725. ScholarBank@NUS Repository. https://doi.org/10.1115/HT2009-88585
Abstract: In this paper, we have designed a compact and efficient liquid-cooled heat sink for mini-sized electronic devices, particularly for very-large-scale integrated (VLSI) circuits. The heat sink can either be an integral part of the silicon (or metal) substrate, or a separate part attached onto the substrate. The heat sink consists of several wavy microchannels, with hydraulic diameter on the order of 100 μm, microfabricated on a silicon or metal substrate. The fluid flow and heat transfer performance of the heat sink are studied using numerical simulations in the steady laminar flow region and the dynamical system technique using Poincaré sections is employed to analyze the fluid mixing. It is found that when the liquid coolant flows through the wavy microchannel, Dean vortices can develop. The quantity and location of the Dean vortices may change along the flow direction, which can lead to laminar chaos. The chaotic advection greatly enhances the fluid mixing, and thus the heat transfer performance of the present heat sink is much more superior than previous designs which employed straight microchannels. It is also found that the pressure drop penalty is much smaller that the heat transfer enhancement for the present heat sink. Furthermore, the relative wavy amplitude (wavy amplitude/wavelength) of the channels can be varied along the flow direction for various purposes, without compromising the compactness and efficiency of the heat sink. The relative waviness can be increased along the flow direction, which results in higher heat transfer coefficients and renders the temperature for the devices much more uniform. The relative waviness can also be designed to be higher in regions of high heat flux for hot spot mitigation purposes. Copyright © 2009 by ASME.
Source Title: Proceedings of the ASME Summer Heat Transfer Conference 2009, HT2009
URI: http://scholarbank.nus.edu.sg/handle/10635/51560
ISBN: 9780791843567
DOI: 10.1115/HT2009-88585
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

2
checked on Feb 20, 2018

Page view(s)

41
checked on Feb 23, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.