Please use this identifier to cite or link to this item: https://doi.org/10.1021/la302262g
Title: Dynamics of wicking in silicon nanopillars fabricated with interference lithography and metal-assisted chemical etching
Authors: Mai, T.T.
Lai, C.Q.
Zheng, H.
Balasubramanian, K.
Leong, K.C.
Lee, P.S. 
Lee, C. 
Choi, W.K. 
Issue Date: 7-Aug-2012
Source: Mai, T.T., Lai, C.Q., Zheng, H., Balasubramanian, K., Leong, K.C., Lee, P.S., Lee, C., Choi, W.K. (2012-08-07). Dynamics of wicking in silicon nanopillars fabricated with interference lithography and metal-assisted chemical etching. Langmuir 28 (31) : 11465-11471. ScholarBank@NUS Repository. https://doi.org/10.1021/la302262g
Abstract: The capillary rise of liquid on a surface, or "wicking", has potential applications in biological and industrial processes such as drug delivery, oil recovery, and integrated circuit chip cooling. This paper presents a theoretical study on the dynamics of wicking on silicon nanopillars based on a balance between the driving capillary forces and viscous dissipation forces. Our model predicts that the invasion of the liquid front follows a diffusion process and strongly depends on the structural geometry. The model is validated against experimental observations of wicking in silicon nanopillars with different heights synthesized by interference lithography and metal-assisted chemical etching techniques. Excellent agreement between theoretical and experimental results, from both our samples and data published in the literature, was achieved. © 2012 American Chemical Society.
Source Title: Langmuir
URI: http://scholarbank.nus.edu.sg/handle/10635/50904
ISSN: 07437463
DOI: 10.1021/la302262g
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

25
checked on Dec 13, 2017

WEB OF SCIENCETM
Citations

24
checked on Nov 15, 2017

Page view(s)

43
checked on Dec 16, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.