Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/35821
Title: CRITICAL DIMENSION AND TEMPERATURE CONTROL IN MULTI-ZONE THERMAL PROCESSING
Authors: FENG YONG
Keywords: Critical Dimension, Thermal Processing, MMPC, Lithography, Temperature control, real-time control
Issue Date: 7-Jan-2011
Source: FENG YONG (2011-01-07). CRITICAL DIMENSION AND TEMPERATURE CONTROL IN MULTI-ZONE THERMAL PROCESSING. ScholarBank@NUS Repository.
Abstract: In this thesis, the application of advanced process control techniques for thermal processing in the lithography steps is investigated to improve lithography performance, as Critical Dimension (CD) uniformity is sensitive to the temperature during thermal processing steps. A real-time temperature control approach is proposed for warped wafers. It is demonstrated that real-time control of the temperature to give nonuniform temperature distribution across a warped wafer can reduce CD non-uniformity across the wafer. Multiplexed Model Predictive Control (MMPC) has been newly proposed as a strategy to reduce computational complexity. It is experimentally demonstrated in the thermal processing that MMPC bears a much lower of increment rate of computational time than conventional MPC. In order to provide a framework for systematic analysis of the MMPC, a formula to compute the Integral Square Error performance for load disturbance is derived and validated on a multi-zone thermal process.
URI: http://scholarbank.nus.edu.sg/handle/10635/35821
Appears in Collections:Ph.D Theses (Open)

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