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Title: Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact
Keywords: Solder Electronics Drop Shock Impact Fatigue
Issue Date: 17-Aug-2012
Citation: SEAH KAH WOON, SIMON (2012-08-17). Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact. ScholarBank@NUS Repository.
Abstract: This thesis investigates solder joint failure in portable electronics under dynamic loads caused by drop impact. New experimental methods are developed to understand the mechanics and physics of impact-induced solder joint damage. In-situ monitoring of crack growth in solder joints during the drop impact of a mobile electronic device reveals that failure occurs by very low cycle fatigue, with cracks often initiating in the very first drop of the mobile device. Subsequent crack growth occurs gradually or rapidly depending on whether the crack remains in the bulk solder or propagates into the intermetallic compound (IMC) layers. To characterise this low cycle fatigue behaviour, dynamic bending experiments were performed on electronic assemblies to investigate the effect of various parameters ¿ materials, strain rate and temperature ¿ on solder joint failure. Failure prediction methodologies are proposed using the fatigue properties obtained, and validated using drop impact experiments on mobile electronic devices.
Appears in Collections:Ph.D Theses (Open)

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