Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/35495
Title: ULTRA LOW STRESS METHOD FOR EPOXY RESINS: STRESS-TRANSFER
Authors: SIOW, KOK, SIONG 
WANG, HONGBING 
XIE, HONG
Issue Date: 27-May-1999
Source: SIOW, KOK, SIONG,WANG, HONGBING,XIE, HONG (1999-05-27). ULTRA LOW STRESS METHOD FOR EPOXY RESINS: STRESS-TRANSFER. ScholarBank@NUS Repository.
Abstract: A method based on a new concept of stress-transfer for reducing the interfacial residual stress in epoxy resins by using a unique type of modifiers is described. The modifiers used must have a continuous or semi-continuous structure (i.e., a non-particle structure) such as sheet, film, plate, etc. The modifiers are prepared from the following materials: metals, ceramic materials or thermoplastic polymers, etc, with or without a surface coating with elastomers. The method is able to reduce the stress in the resins to an ultra low level, i.e., to a near zero or zero level, without compromising other important properties of the resins such as the good process flow property, adhesion strength and gelation time, etc. It can also be applied in a controllable way, i.e., to reduce the interfacial residual stress in epoxy resins to different levels. The method is also useful for reducing residual stress in other polymers, compositions and resins.
URI: http://scholarbank.nus.edu.sg/handle/10635/35495
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