Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/35266
Title: Planar microspring integrated circuit chip interconnection to next level
Authors: TAY, ANDREW AH ONG 
ANG, SIMON SAW-TEONG 
LIAO, EBIN
Issue Date: 7-Sep-2006
Source: TAY, ANDREW AH ONG,ANG, SIMON SAW-TEONG,LIAO, EBIN (2006-09-07). Planar microspring integrated circuit chip interconnection to next level. ScholarBank@NUS Repository.
Abstract: An interconnect structure for interconnecting an integrated circuit (IC) chip to a next level, a method of fabricating the interconnect at wafer level, and a method of interconnecting an integrated circuit (IC) chip to the next level. The interconnect structure comprises one or more planar micro-spring elements formed on a packaging surface of the chip and connected to an interconnection pad; wherein the interconnection pad is resiliently moveable horizontally and vertically with respect to the surface of the chip. A layer of solder is preferably electroplated onto the interconnection pad to provide interconnection to the next level. In a variation of the interconnect structure, a metal column is fabricated onto the interconnection pad prior to electroplating the solder layer.
URI: http://scholarbank.nus.edu.sg/handle/10635/35266
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